KLIC
Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Industries, Inc.KLIC

Technology · Semiconductor Equipment & Materials
89.54USD
+6.49%
Sep 23, 2026
KLIC overview ready
Advanced packaging bottleneck supplier
Semiconductor-assembly capital-equipment enabler, with legacy wire-bonding exposure and a more direct growth option in thermo-compression bonding and other advanced-packaging process equipment.
Strong narrative exposure
Exposed to the Semiconductor Supply Chain Localization narrative through Advanced Packaging and Semiconductor Test — enabling supplier.
No clear price read
Longer-term context reads near trend floor, with a near-term setup of daily advance.
Attractive valuation
Current market expectations look undemanding relative to the strength of its balance sheet.
Fundamentals under pressure
Free cash flow yield is weak.
Primary risk
Execution risk on advanced packaging equipment ramp.
Market Sep 22Filing Jul 4Price action Sep 22Research Sep 22

Conviction Level

NarrativeHeat8.7ThemeHeat8.0PriceAction4.0Valuation9.5CompanyPosition9.5
Price
Loading price history…

Price Action

No clear price read
Longer-term context reads near trend floor, with a near-term setup of daily advance.
EntryReset + recovery

The stock remains extended from its long-term weekly base, but the recent reset toward the daily SMA200. Daily structure is recovering above the fast averages, improving the current entry location.

Key Financials

Market Cap
$4.7B
Avg Volume (60D)
871.2K
60 sessions
Revenue Growth YoY
-7.4%
FY2025 vs FY2024
Gross Margin
+48.2%
Trailing twelve months
Operating Margin
+13.2%
Trailing twelve months
Free Cash Flow Yield
+0.9%
Distance from 200DMA
+10.7%
Next Earnings
2026-11-18
P/E
40.5x
Market metrics as of Sep 22, 2026
Financial results for the period ended Jul 4, 2026
Filed balance-sheet data as of Jul 4, 2026

Fundamentals & Valuation

One of the two valuation perspectives says cheap; peers is the dissenting view.
Kulicke and Soffa Industries, Inc. has a Cheap valuation stance because current market expectations look undemanding relative to the strength of its balance sheet. It trades at a 0.9% free-cash-flow yield, which the underlying economics comfortably support.

Company Research

Thesis
Semiconductor-assembly capital-equipment enabler, with legacy wire-bonding exposure and a more direct growth option in thermo-compression bonding and other advanced-packaging process equipment. KLIC is a genuine advanced-packaging equipment participant rather than a generic semiconductor adjacency.
Opportunity
High opportunity
Chipmaker, foundry and OSAT investment in advanced assembly, high-density interconnect, heterogeneous integration and test capacity needed for AI, HBM and other complex semiconductor devices.
Key risk
Execution risk on advanced packaging equipment ramp.

Narrative & Theme

Semiconductor Supply Chain Localization
Part of Advanced Packaging and Semiconductor Test, with strong fit.
KLIC is a genuine advanced-packaging equipment participant rather than a generic semiconductor adjacency.
Narrative HeatHot8.7 / 10
Theme HeatHeating up8.0 / 10

Business & Markets

Technology · Semiconductor Equipment & Materials
What they do

Kulicke and Soffa designs, manufactures, and sells capital equipment and consumables used to assemble semiconductor devices, operating globally through multiple segments including bonding equipment and aftermarket services.

How it earns

Transactional revenue from sales of equipment and consumables, plus services related to semiconductor device assembly.

Products & services
Ball Bonding Equipment
Wedge Bonding Equipment
Advanced Solutions
Aftermarket Products and Services
Customers & end markets
Semiconductor manufacturers
Integrated circuit assemblers
LED and sensor manufacturers
Market position

Leader in thermocompression and hybrid bonding equipment within the semiconductor packaging equipment industry.

Demand drivers
High cyclicality

Semiconductor equipment demand is closely tied to semiconductor industry cycles and capital spending patterns.