Advanced Packaging
Back-end packaging of chips: outsourced packaging & test providers (OSAT) and assembly equipment. Test equipment and materials are separate themes; each member's role is shown.
Leadership as of 2026-10-27: Tracked (too few stocks for a leadership state). Relative to SPY: 5 sessions −1.3pp, 21 sessions −15.0pp, 63 sessions +2.1pp. Participation 0%; 3 of 3 members eligible.
- fewer than 5 eligible members
Economic family: Semiconductors
Member companies
Related themes
- EDA & Semiconductor IP: Lagging — 21-session vs SPY −2.8pp, participation 40%
- Analog Semiconductors: Lagging — 21-session vs SPY −5.6pp, participation 40%
- Edge AI & Embedded Processors: Lagging — 21-session vs SPY −7.6pp, participation 20%
- AI Compute Semiconductors: Lagging — 21-session vs SPY −10.1pp, participation 0%
- Power Semiconductors: Lagging — 21-session vs SPY −11.4pp, participation 14%
- Connectivity Semiconductors: Lagging — 21-session vs SPY −15.4pp, participation 0%
- Wafer Fab Equipment: Lagging — 21-session vs SPY −19.7pp, participation 0%
- Memory Semiconductors: Lagging — 21-session vs SPY −20.3pp, participation 0%